Important patents in the field of substrate technology
14/66-(C)WPI/DERWENTAN-2003-471316[45]
212/66-(C)WPI/DERWENTAN-2003-058242[05]
317/66-(C)WPI/DERWENTAN-2002-668694[72]
418/66-(C)WPI/DERWENTAN-2002-652100[70]
521/66-(C)WPI/DERWENTAN-2002-331789[37]
624/66-(C)WPI/DERWENTAN-2002-239745[29]
727/66-(C)WPI/DERWENTAN-2002-089759[12]
829/66-(C)WPI/DERWENTAN-2001-259683[27]
939/66-(C)WPI/DERWENTAN-2000-064719 [06]
1040/66-(C)WPI/DERWENTAN-2000-055564[05]
1148/66-(C)WPI/DERWENTAN-1999-363504[31]
[Application No.] 02802023 [Invention Name] Method and device for obtaining monocrystalline single-crystal gallium-containing nitride [Application No.] 200410002946 [Invention Name] Method for manufacturing a Group III nitride substrate
Extension of some important patents
13/117-(C)WPI/DERWENTUS2003085409NOVELTY
25/117-(C)WPI/DERWENTJP2003086903NOVELTY
37/117-(C)WPI/DERWENTUS2003015713NOVELTY
410/117-(C)WPI/DERWENTWO200297904NOVELTY
511/117-(C)WPI/DERWENTWO200289220NOVELTY
627/117-(C)WPI/DERWENTUS2002008243NOVELTY
728/117-(C)WPI/DERWENTKR2001068216NOVELTY
830/117-(C)WPI/DERWENTEP1132977NOVELTY
931/117-(C)WPI/DERWENTTW442984NOVELTY
1033/117-(C)WPI/DERWENTWO200169662NOVELTY
1143/117-(C)WPI/DERWENTGB2352329NOVELTY
1272/117-(A)WPI/DERWENTGB2320365
1377/117-(A)WPI/DERWENTGB2317053
1479/117-(A)WPI/DERWENTWO9750132
1581/117-(A)WPI/DERWENTUS5684309
1686/117-(A)WPI/DERWENTEP772249
1791/117-(A)WPI/DERWENTEP-762516
18109/117-(B)WPI/DERWENTEP622858
1910/117-(C)WPI/DERWENTEP-599224
20113/117-(C)WPI/DERWENTEP-497350
21114/117-(C)WPI/DERWENTDE4006449
Important patents on chip structure: Surface roughening:
11/6-(A)WPI/DERWENTEP1271665NOVELTY
23/6-(A)WPI/DERWENTGB2311413
34/6-(A)WPI/DERWENTDE19537544
46/6-(A)WPI/DERWENTEP-404565
Second, the chip shape:
51/21-(A)WPI/DERWENTEP1331673NOVELTY
64/21-(B)WPI/DERWENTUS2002017652NOVELTY
75/21-(A)WPI/DERWENTFR2809534NOVELTY
87/21-(A)WPI/DERWENTWO200205358NOVELTY
99/21-(A)WPI/DERWENTWO200203477NOVELTY
1010/21-()WPI/DERWENTWO200161765NOVELTY
1115/21-(A)WPI/DERWENTGB2326023
1216/21-(A)WPI/DERWENTEP-766324
Third, the substrate peeling:
131/15-(A)WPI/DERWENTUS2003032210NOVELTY
143/15-(A)WPI/DERWENTUS2002034835NOVELTY
154/15-(A)WPI/DERWENTWO200219439NOVELTY
165/15-(A)WPI/DERWENTWO200182384NOVELTY
177/15-(A)WPI/DERWENTEP1065734NOVELTY
188/15-(A)WPI/DERWENTEP1059662NOVELTY
199/15-(A)WPI/DERWENTCN1262528NOVELTY
2010/15-(A)WPI/DERWENTGB2346480NOVELTY
2111/15-(A)WPI/DERWENTGB2346479NOVELTY
Fourth, dicing, lobes:
221/19-(A)WPI/DERWENTDE10102315NOVELTY
233/19-(A)WPI/DERWENTEP1223625NOVELTY
244/19-(A)WPI/DERWENTWO200256365NOVELTY
258/19-(A)WPI/DERWENTJP11251265NOVELTY
269/19-(A)WPI/DERWENTGB2322737
2710/19-(A)WPI/DERWENTWO9807190
2814/19-(A)WPI/DERWENTUS5418190
2917/19-(A)WPI/DERWENTEP-341034
3018/19-(A)WPI/DERWENTDE3731312
Five, the electrode
313/36-(A)WPI/DERWENTUS2002074556NOVELTY
325/36-(A)WPI/DERWENTDE10048196NOVELTY
339/36-(A)WPI/DERWENTEP1168460NOVELTY
3412/36-(A)WPI/DERWENTDE10017758NOVELTY
3522/36-(A)WPI/DERWENTWO9834285
3623/36-(A)WPI/DERWENTEP858114
3727/36-(A)WPI/DERWENTJ09298313
3830/36-(A)WPI/DERWENT(Ni/Au)J09064337
3935/36-(C)WPI/DERWENTEP622858
4036/36-(C)WPI/DERWENTEP-579897
Sixth, etching
411/11-(A)WPI/DERWENTUS2003042496NOVELTY
422/11-(A)WPI/DERWENTWO200175952NOVELTY
4311/11-(A)WPI/DERWENT
Seven, photonic crystal
441/22-(A)WPI/DERWENTJP2003215366NOVELTY
452/22-(A)WPI/DERWENTUS2003053790NOVELTY
4613/22-(A)WPI/DERWENTUS6339030NOVELTY
4717/22-(A)WPI/DERWENTJP2001091777NOVELTY
4819/22-(A)WPI/DERWENTJP2000329953NOVELTY
4920/22-(A)WPI/DERWENTAB-JP2000121987NOVELTY
Eight, microstructure
501/8-(A)WPI/DERWENTWO200141219NOVELTY
516/8-(A)WPI/DERWENTWO9641372
Nine, passivation
521/10-(A)) WPI/DERWENTUS2003025121NOVELTY
536/10-(A)WPI/DERWENTUS6316820NOVELTY
Encapsulating some important patents
1487823625012507
34935951434677
5595291665748706
7628908B186009148
9595291610649611B1
116504908B1126471373B1
136590235B2146274924B1
156204523B1160041222A1
170113244A1186294800B1
190050371A1202002/0003233A1
212001/0002049A1226163038
236252254B1246255670B1
252001/0001207A1262003/0025212A1
272003/0133300A128
Domestic patent number:
101144153.4203203645.0
301278462.1
Apply some important patents
11/680 (1/501 WPI)-(C)WPI/DERWENTAN-2003-599625 [57]
22/680 (2/501 WPI)-(C)WPI/DERWENTAN-2003-593485[56]
33/680 (3/501 WPI)-(C)WPI/DERWENTAN-2003-583845[55]
44/680 (4/501 WPI)-(C)WPI/DERWENTAN-2003-563377[53]
57/680 (7/501 WPI)-(C)WPI/DERWENTAN-2003-527984[50]
69/680 (9/501 WPI)-(C)WPI/DERWENTAN-2003-509617[48]
712/680 (12/501 WPI)-(C)WPI/DERWENAN-2003-499934[47]
813/680 (13/501 WPI)-(C)WPI/DERWENTAN-2003-452708[43]
917/680 (17/501 WPI)-(C)WPI/DERWENTAN-2003-377151[36]
1099/680 (99/501 WPI)-(C) WPI/DERWENTAN-2002-286857 [33]
11100/680 (100/501 WPI)-(C) WPI/DERWENTAN-2002-284455 [33]
12101/680 (101/501 WPI)-(C)WPI/DERWENTAN-2002-272509[32]
1381/680 (81/501 WPI)-(C)WPI/DERWENTAN-2002-406362[44]
1479/680 (79/501 WPI)-(C)WPI/DERWENTAN-2002-418104[45]
1578/680 (78/501 WPI)-(C) WPI/DERWENTAN-2002-418683 [45]
1676/680 (76/501 WPI)-(C) WPI/DERWENTAN-2002-482968 [52]
17100/680 (100/501 WPI)-(C)WPI/DERWENTAN-2002-284455 [33]
18107/680 (107/501 WPI)-(C)WPI/DERWENTAN-2002-233237[29]
19114/680 (114/501 WPI)-(C) WPI/DERWENTAN-2002-210292 [27]
20121/680(121/501WPI)-(C)WPI/DERWENTAN-2002-161576[21]
21168/680 (168/501 WPI)-(C)WPI/DERWENTAN-2001-151142[16]
22176/680 (176/501 WPI)-(C) WPI/DERWENTAN-2000-675646 [66]
23251/680 (251/501 WPI)-(C)WPI/DERWENTAN-1999-138028[12]
24255/680 (255/501 WPI)-(C)WPI/DERWENTAN-1999-052102[05]
25257/680 (257/501 WPI)-(C)WPI/DERWENTAN-1998-605379[51]
26268/680 (268/501 WPI)-(C) WPI/DERWENTAN-1998-380708 [33]
27276/680 (276/501 WPI)-(C)WPI/DERWENTAN-1998-236711[21]
28285/680 (285/501 WPI)-(C)WPI/DERWENTAN-1998-097215[09]
29301/680 (301/501 WPI)-(C)WPI/DERWENTAN-1997-386962[36]
30345/680 (345/501 WPI)-(C) WPI/DERWENTAN-1996-213024 [22]
31370/680 (370/501 WPI)-(C)WPI/DERWENTAN-1995-064865[09]
32376/680 (376/501 WPI)-(C) WPI/DERWENTAN-1994-257830 [32]
33379/680 (379/501 WPI)-(C) WPI/DERWENTAN-1994-191785 [23]
Diffraction Grating,Diffraction Gratings,Grating Optics,Holographic diffraction grating, Holographic Grating
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