The LED chips in the LED lamp are electronic components with high heat flux density. During operation, due to their static and dynamic losses, a large amount of excess heat is generated, which is radiated to the outside through the heat dissipation system to maintain the stability of its working temperature. At present, the luminous efficiency of LEDs is still relatively low, resulting in an increase in junction temperature and a decrease in lifetime. In order to reduce the junction temperature to improve the life, it is necessary to pay great attention to the problem of heat dissipation. The heat dissipation design of the LED must be from the beginning of the chip to the entire heat sink, and every step must be given full attention. Improper design of any link can cause serious heat dissipation problems. Therefore, the design of heat dissipation must be given full attention.
The high-performance micro-slot group composite phase-change heat transfer technology meets the heat dissipation requirements of high-power LED lighting. The technology is named “micro-slot group composite phase change integrated cooling technologyâ€. The technology has been successfully applied to the LED lamp, and the heat of the LED chip can be instantaneously distributed in the entire heat dissipation space, which prolongs the life of the LED lamp and improves the luminous efficiency.
First, micro-slot group composite phase change integrated cooling technology:
The heat generated by the LED chip is always dissipated into the air through the outer casing of the luminaire. The general heat dissipation is: the heat generated by the LED chip comes out of its metal heat sink, first through the solder to the PCB of the aluminum substrate, and then through the thermal adhesive to the aluminum heat sink. The heat dissipation of LED lamps actually includes two parts: heat conduction and heat dissipation. One concept to be clear first is the difference between heat conduction and heat dissipation. Heat conduction is to transfer heat from the heat source to the surface of the heat sink as quickly as possible, while heat dissipation is to dissipate heat from the surface of the heat sink to the air. The first thing to do is to export the hottest ones, and then to get the most out of the air. The heat sink of the traditional radiator is aluminum fins, and our heat sink is: micro-groove group phase change technology.
The micro-slot group phase-change cooling technology relies on technical means (such as equipment structure: micro-groove, etc.) to change the closed circulating cooling medium (if the medium is water) into a nano-order water film. The thinner the water film, the thermal evaporation capacity. The stronger the stronger the latent heat exchange capability, the higher the heat of the high-power electronics is carried away by the vapor. 　　
Cooler system composition and working principle:
1. The composition of the cooler: that is, the heat extractor, the condenser, the conveying pipeline, and the heat medium (such as water, ethanol, etc.).
The heat extractor is generally made of imported aluminum alloy. The inner cavity of the plate has many channels of micron order. Its function is to change the heat taking medium (such as water) into the required liquid film according to the design requirements. The heating power device and the aluminum alloy The surface is in close contact, and the heat energy is transferred to the liquid film through the heat of the aluminum, and the liquid film is instantaneously vaporized, and the heat energy is sent to the condenser through the pipeline for cooling. Because the heat extraction capacity of the heat extractor is very strong, its thermal conductivity is greater than 106 W/(m*°C), so the volume of the heat extractor can be made small.
The condenser is generally made of imported aluminum alloy. The inner cavity of the plate has many channels of the order of millimeters. The aluminum alloy plate has fins outside. The heat medium is sent through the pipeline to transfer heat energy. It is responsible for convective heat exchange with the outdoor air. Radiation heat transfer, the heat energy of the heat medium is released by the condenser, and the liquid state changes from liquid state to liquid state. The liquid heat taking medium returns to the heat extractor by its own gravity to prepare for the next heat energy exchange cycle.
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