The Application of IPC-820, the New Concept Industrial Control Computer of the Third Generation of EVOC in the LED Solid Crystal Machine System

First, system overview

Due to the increasing awareness of environmental protection and energy conservation in the world, under the circumstances in which countries have vigorously introduced laws and regulations such as promoting energy conservation and emission reduction and actively responding to climate change, China has proposed the target of reducing energy consumption per unit of GDP and reducing emission of major pollutants. In 2016, China completely banned the sale of incandescent bulbs of various wattages, which undoubtedly provided a huge market opportunity for the promotion and popularization of LED applications in China. With the rapid development of the LED industry, the demand for LED production equipment is also increasing. The demand for semiconductor devices such as crystal bonders is increasing in the market. At the same time, the rapid development of the IPC technology to meet the above needs Provides a guarantee. EVOC IPC-820 is a special computer with high reliability and stability. It has been widely used in the control, processing and machine vision of advanced LED solid crystal machines, which greatly improves the degree of automation of LED dies and makes the equipment In the accuracy, speed, human-computer interaction and other aspects more optimized.

The LED packaging industry's mid-stream packaging technology (solid crystal machine, wire bonding machine, dispenser, etc.) is basically in the hands of companies in mainland China and Taiwan, reducing manpower, improving product consistency, improving product quality, and more suitable for large quantities. Production, reduction of production costs, and improvement of production efficiency have become the goals pursued by these companies, and automated production equipment has provided effective guarantees for these enterprises to increase production efficiency, reduce costs, and improve the consistency of products, thus effectively and effectively improving the competition of enterprises. Force, especially to improve product accuracy, without using automated production, simply can not meet production needs.

Second, the system requirements

LED solid state crystal machine is an automatic equipment that can pick and place LED chips from the wafer plate and mount it on the PCB (printed circuit board) to realize the functions of automatic bonding and defect wafer detection of LED chips. It can meet the requirements of most LED production lines. For a variety of high-quality, high-brightness LED (red, green, white, yellow, etc.) production, some can be applied to the transistor, semiconductor discrete devices, DIP and SOP and other products, a wide range of applications, versatility.

The system structure of the LED solid crystal machine mainly includes a motion control module, an aerodynamic part, a machine vision part, and a motion execution mechanism module, and realizes data communication with a special computer control center through a PCI bus interface.

Working principle: The feeding mechanism conveys the PCB board to the working position on the workbench fixture. The glue dispensing mechanism first dispenses the glue on the PCB, and then the bonding arm moves from the original position to the suction wafer position. The wafer is placed on a thin film-supported expander wafer tray. After the bonding arm is in place, the suction nozzle moves downward. The ejector pin moves the ejected wafer upward. After picking up the wafer, the bonding arm returns to the original position (leaky crystal detection position), and the bonding arm Then move from the origin position to the bonding position, the nozzle is bonded to the wafer and the bonding arm returns to the original position again. This is a complete bonding process. After a tempo run is completed, the machine vision senses the data at the next position on the wafer and transfers the data to the wafer motor. After the motors have traveled a corresponding distance, the next wafer is moved to the aligned picking wafer position. The PCB bonding position of the PCB is the same process, until all PCBs are glued to the wafer, the PCB is removed from the table by the transfer mechanism, and a new PCB board is installed. Work cycle.

Third, the system description

The motion control system of the solid crystal machine system generally adopts the combination of a motion control card based on the PCI bus and the industrial control computer. The pneumatic part and the machine vision part also realize data communication with each other through the PCI bus, through the image recognition system, motion control and Pneumatic grabbing and other module systems are combined to realize the automatic high-speed solid crystal function of automatic LED solid crystal control based on machine vision. The fuzzy control algorithm and high-precision digital servo control method are adopted to realize the multi-axis control of the solid crystal machine. , Motion timing coordination, high-precision, high-speed operation control.

The movement control part of the LED solid crystal machine system is realized by a servo motor and a stepping motor, and each motor movement is controlled by an industry-specific computer and a motion control card. The industry-specific computer is a core part of the LED solid crystal machine control system. Mainly responsible for man-machine interaction interface management and control system real-time monitoring work, release motion instructions, effectively handle the control card acquisition and transmission of information, so that all aspects to achieve the expected movement, to ensure the mechanical position accuracy detection and operational safety.

Under the industry-specific computer control of the Windows platform, the LED solid crystal machine system can make full use of hardware resources, greatly speeding up data processing speed, improving system operation efficiency, and adopting a visual user interface program with a friendly human-machine interface.

Fourth, the system block diagram


V. Product List

Main Control Equipment: EVOC EPE Machine IPC-820

The motherboard of the main control device is a high-performance platform with Intel® H61 chipset supporting Intel® LGA1155 packaged dual-core, quad-core I3, I5, I7 and other CPUs; it supports two 800M/1066M/1333M DDR3 memory modules. The total capacity of the largest support 16GB; Onboard 2 10/100/1000Mbps network interface; Support VGA + VGA, VGA + DVI dual display capabilities; Support 4 SATA interface; 10 USB 2.0 interfaces, 2 serial ports (1 of them Supports rich I/O interfaces such as RS-232/RS-422/RS-485 and 1 parallel port.

The chassis is a 4U 19" rack-mount chassis. The chassis is made of 1.2mm thick high-quality steel plate, sprayed with high-temperature baking paint, and has a strong structure. It has excellent heat dissipation, vibration resistance and radiation resistance, and can meet vibration, For the use of harsh working environment such as electromagnetic interference, the CPU board and backplane of the main control equipment are designed with the Evobus Evo bus. The connection between the CPU board and the backplane is implemented using the CPCI pinhole connector.

VI. Advantages of EVOC products

1. The whole system adopts the EVOC EPE bus design. The CPCI pinhole connector is connected between the CPU board and the backplane. It is surrounded by 360 degrees and has a high degree of hermeticity, anti-corrosion and oxidation resistance, and dust resistance. Dirty, wet, high/low temperature, corrosive and other industrial bad environment caused by contact with the contact surface between the plugging, oxidation or mold caused by poor electrical contact, completely eliminate the gold finger connection in the actual use of all the bad performance , to ensure the reliability of the IPC work;

2. Once the CPU board is in place, the relative displacement between the female and male contact surfaces of the CPCI pinhole connector will not occur, relative friction will not be generated, the conductive layer will not be damaged, the ability of the system to resist vibration and impact will be improved, and the equipment Requirements for long-term reliable operation in vibration environments;

3. The unique CPU backplane bracket design shifts the weight of the CPU heatsink to the metal chassis, avoiding the unbalance of the contact force between the CPCI and the connector, and at the same time making the two connectors more stable and without relative displacement. Further improve the ability of the whole machine to work reliably under vibration environment;

4. EPE bus computer solves the traditional gold finger industrial computer platform can not supply power through the backplane, resulting in complex chassis routing; EPE bus defines PS-ON #, 5V SBS (2A) and other signals, 12V power supply has 5 pins can withstand 7A Current, to avoid control connection between the backplane and the CPU board when using the ATX power supply;

5. The EPE bus system expansion interface prioritizes high-speed control signal routing in the signal distribution. The ground signal and the high-speed control signal pins are adjacent to each other, avoiding the influence of large distributed capacitance on the signal transmission line, thereby enhancing the signal. Integrity, enhanced EMC performance, enhanced reference and shielding of high-speed signals to the ground, making the PCI, PCIE extended signal quality has been greatly improved, ensuring the reliability of the system;

6. The whole system adopts the “Real-time Monitoring Intelligent System for Industrial Computer Operation Status” created by EVOC. It can monitor the temperature of the critical components of the system and the internal temperature of the system in real time, and can control the heat dissipation according to the temperature conditions in real time through computer technology. The device works intelligently. According to different CPU temperatures, the temperature-controlled fan will have different speed adjustments corresponding to it. In this process, the operator can also directly check the temperature of the changing CPU core in real time. Through this intelligent interactive system, it can be effective. To prevent the system from overheating and running, even if problems occur during operation, they can know where the problem is at the moment and provide guidelines for the operators to operate effectively to avoid the embarrassing situation of “being aware of the problem and not knowing why.”

8. The whole system adopts oil cushion to shock-proof the hard disk, and soft cushion is used between the hard disk and its mounting bracket to prevent the hard disk and the bracket from colliding with each other under external shock and impact force. , In order to effectively protect the hard disk from vibration or impact damage; oil cushioning structure is simple, suitable for wide temperature environment, long service life, able to shock three-dimensional vibration, compatible with different weight objects shock absorption.

Seven conclusions

EVOC EPE bus products have the characteristics of long-term trouble-free and stable operation in harsh industrial environments, and can well meet the hardware requirements under various harsh environments such as dust, humidity, high/low temperature, corrosion and vibration.

Over the years, EVOC has accumulated many experiences and successful cases in automation control, machine vision, and CNC machine tool design. EVOC will make unremitting efforts to provide cost-effective products and technical services for everyone.

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