At present, the mainstream heat sink substrates on the market are still aluminum substrates and copper substrates, and some manufacturers have begun to try to develop and produce ceramic substrates.
A new type of package substrate developed between Al and ceramics using AlSiC composite materials will soon be introduced to the market by Xi'an Mingke Microelectronics Materials Co., Ltd. (hereinafter referred to as "Xi'an Mingke").
AlSiC composite material combines the advantages of silicon carbide ceramic and metal aluminum, has high thermal conductivity, thermal expansion coefficient matched with chip, low density, light weight, high hardness and high bending strength. It is a new generation of electronics. The best in packaging materials.
"It has a higher glass transition temperature. The glass temperature of general metal materials is 225 ° C, but this material can reach 400 ° C." Xi Yong Mingke technical director Wang Yong told reporters that AlSiC composite material solves the problem that metal materials are easily deformed by heat. problem. “The same thickness deformation ability is small, basically unchanged.â€
According to Wang Yong, the packaging power density of AlSiC composites is about 40% higher than that of metal materials, which means that the same area can obtain more package power. In addition, it makes LED lamps have less light attenuation every 3000 hours. Light decay is about 1‰.
AlSiC composite package substrate
It is precisely because AlSiC composite materials have many advantages that other materials can't match, and it has been widely used in aviation, aerospace, high-speed rail and microwave. In order to better push the material to the civilian market and solve the problem of LED heat dissipation, Xi'an Mingke independently developed an LED package substrate based on AlSiC composite material.
"This package substrate is slightly more expensive than the aluminum substrate, and the price of the copper substrate is basically the same." Chairman Ma Junli introduced that Xi'an Mingke's AlSiC composite package substrate can be customized according to customer needs, and has been with some large The listed companies are cooperating and are conducting trial production in small batches of products.
"We also hope that through the high-tech LED lighting exhibition, through the high-tech LED platform to better promote our products, gradually bring our products to the market, and mass production." Ma Junli said that the future LED The luminaires are becoming lighter and thinner. Due to the light weight of the AlSiC composite materials, the LED luminaires can be made smaller and more flexible.
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