“Transitional Global, Core Connectedâ€, March 14-16, SEMICON China 2017 International Semiconductor Exhibition hosted by the China Semiconductor Industry Association (SEMI) China Committee was successfully held at Shanghai New International Expo Center. Shenzhen Cuitao Automation brought its two new wire-bonding machines, which were newly developed and manufactured, to the exhibition. The novel appearance attracted many visitors to watch, and the outstanding performance has won high praise and favor from the domestic and foreign industry.
In 2017, Cui Tao participated in the 11th year of SENICON. During the period, Cui Tao participated in and witnessed the development of China's semiconductor equipment market, and also formed a deep friendship with the industry colleagues. At this exhibition, Cui Tao exhibited the wire bonding machine product, the shuttle 800C, which was newly developed and manufactured in the field of semiconductor IC packaging equipment. At the same time, it also had a pleasant communication with many old and new friends.
In the booth, Cui Tao laid carpets, set comfortable seats and rich refreshments, and a conversation in a relaxed and casual atmosphere, so that the event was successfully completed in laughter and laughter. However, Cui Tao's road to technology R&D, equipment manufacturing, and service solution upgrade is far from over. In the future, Cui Tao will always adhere to the enterprise spirit of “knowing it can't do it†and promote products and services with higher standards. Enhance, give back to the trust of new and old customers, and inspire the rise of national brands.
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