[Text|High-tech LED reporter Yang Jinglin] In recent years, due to the multiple advantages of COB light source, such as easy dimming, color grading, high-density packaging and high integration, COB packaging devices are smaller, easier to assemble, and more cost-effective. high. Therefore, the demand for COB devices in the lighting market is growing, and the market for heat-dissipating substrate materials necessary for COB package accessories is rapidly expanding.
"Benefiting the increase in demand for LED lighting market, it is estimated that the company's LED lighting circuit board capacity can reach more than 100,000 square meters this year, LED circuit board capacity can reach 12-15 million square meters, a significant increase compared with last year." CITIC Hua LED Feng Jiahu, deputy general manager of the business unit, said.
However, due to the high-density packaging of the COB, the internal heat of the lamp is too concentrated, and the ordinary aluminum substrate cannot meet the heat dissipation of the COB package. Therefore, various manufacturers have devoted themselves to the development and development of heat-dissipating substrates suitable for high-power COB devices, and a variety of different COB heat-dissipating substrate materials have emerged on the market.
According to Ren Yongbo, the person in charge of Huanji Industry, this year the company will bring COB mirror silver substrate, glass substrate and ceramic substrate to the high-tech LED lighting exhibition.
The COB mirror silver substrate produced by Huanji Industrial Co., Ltd. is made of German An Aluminum + BT material, with a reflectivity of up to 98%, good heat dissipation performance, high color development, uniform illumination and no spotting; and glass substrate products have 360 °The characteristics of luminescence, high color rendering and high brightness; ceramic base plates have the advantages of high strength, high heat conduction, high insulation and high reflectivity.
"We are very optimistic about the future market of ceramic substrates in the field of LED heat dissipation." Ying Luohua Chairman Wang Pingjin told reporters that this year's high-tech LED lighting exhibition, the company carries LED nano ceramic substrates, LED translucent ceramic filament brackets and other products. Debut.
Wang Pingjin said that Yingluo's LED nano-ceramic square sheets are molded by molding, which has the advantages of laser-free cutting and strong versatility, which can save the laser processing cost and the adverse factors caused by laser, make the surface smooth and burr small. . The LED nano-translucent ceramic filament support product with the specification of 30*1.0*0.4mm is more suitable for automatic lean production, with high productivity and efficiency, strong compatibility, and can meet the process requirements of dispensing, mold sealing, etc., up to 110 per W. -150LM.
At present, heat-dissipating substrate materials such as aluminum substrates, glass substrates, and ceramic substrates of various processes are flooding the LED lighting market, and who can use the substrate materials of COB packaging devices to excel in heat dissipation?
Please look forward to this 2014 (September 26th) 2014 high-tech LED lighting exhibition held at Guangzhou Pazhou Canton Fair. The heat-dissipating substrate manufacturers will discuss the mainstream and trend of COB heat-dissipating substrate materials with you.
"Benefiting the increase in demand for LED lighting market, it is estimated that the company's LED lighting circuit board capacity can reach more than 100,000 square meters this year, LED circuit board capacity can reach 12-15 million square meters, a significant increase compared with last year." CITIC Hua LED Feng Jiahu, deputy general manager of the business unit, said.
However, due to the high-density packaging of the COB, the internal heat of the lamp is too concentrated, and the ordinary aluminum substrate cannot meet the heat dissipation of the COB package. Therefore, various manufacturers have devoted themselves to the development and development of heat-dissipating substrates suitable for high-power COB devices, and a variety of different COB heat-dissipating substrate materials have emerged on the market.
According to Ren Yongbo, the person in charge of Huanji Industry, this year the company will bring COB mirror silver substrate, glass substrate and ceramic substrate to the high-tech LED lighting exhibition.
The COB mirror silver substrate produced by Huanji Industrial Co., Ltd. is made of German An Aluminum + BT material, with a reflectivity of up to 98%, good heat dissipation performance, high color development, uniform illumination and no spotting; and glass substrate products have 360 °The characteristics of luminescence, high color rendering and high brightness; ceramic base plates have the advantages of high strength, high heat conduction, high insulation and high reflectivity.
"We are very optimistic about the future market of ceramic substrates in the field of LED heat dissipation." Ying Luohua Chairman Wang Pingjin told reporters that this year's high-tech LED lighting exhibition, the company carries LED nano ceramic substrates, LED translucent ceramic filament brackets and other products. Debut.
Wang Pingjin said that Yingluo's LED nano-ceramic square sheets are molded by molding, which has the advantages of laser-free cutting and strong versatility, which can save the laser processing cost and the adverse factors caused by laser, make the surface smooth and burr small. . The LED nano-translucent ceramic filament support product with the specification of 30*1.0*0.4mm is more suitable for automatic lean production, with high productivity and efficiency, strong compatibility, and can meet the process requirements of dispensing, mold sealing, etc., up to 110 per W. -150LM.
At present, heat-dissipating substrate materials such as aluminum substrates, glass substrates, and ceramic substrates of various processes are flooding the LED lighting market, and who can use the substrate materials of COB packaging devices to excel in heat dissipation?
Please look forward to this 2014 (September 26th) 2014 high-tech LED lighting exhibition held at Guangzhou Pazhou Canton Fair. The heat-dissipating substrate manufacturers will discuss the mainstream and trend of COB heat-dissipating substrate materials with you.
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