First, improve the performance of fast molds and improve the accuracy of fast molds. Good mold performance and high mold accuracy are key issues for rapid mold application and promotion.
1. Improve the performance of fast molds: In order to obtain high-quality product parts and better mold performance, it is required that the working surface of the rapid mold is hard and wear-resistant, and can withstand the temperature cycle of high temperature and drastic change. It has high thermal conductivity so that heat can be transferred quickly from the workpiece. In addition, it should have good fracture toughness to withstand fatigue cycles. In order to enable the mold to meet the above performance requirements, the conventional method is to use heat treatment or surface coating. In addition, more advanced methods can be used to change the performance of the mold: 1. Using functionally graded materials; 2. Using computer-aided engineering and virtual manufacturing techniques.
2. Improve the accuracy of fast molds. Due to the layered manufacturing principle of RP technology and the certain errors in the RP and RT conversion process and the reasons of the RT material itself, the accuracy of the original prototypes is directly or indirectly manufactured to produce precise and rapid molds. A key issue. With the development of rapid prototyping and rapid mold manufacturing technology, the continuous integration of other technologies with RP and RT technologies, in the near future, high-precision rapid molds will have significant development.
Second, the development of a variety of models of mold making technology. With the development of science and technology, in the field of manufacturing, three models of molds have emerged.
1. Traditional molds. It is also used in traditional manufacturing processes, it is suitable for mass production, usually metal materials are machined.
2, no mold forming. This was the model proposed in the early 1990s, which envisages designing products on CAD systems and producing the products directly on a computer-controlled device without the need for any molds.
3. Disposable molds. This is an intermediate mode between the first two modes. This mode can significantly reduce the cost and time of manufacturing the mold. This mold can be used to produce a batch of products, and the used molds can be used to produce discarded molds. After that, new molds can be made to produce more products.
Rapid soft molds and fast transition molds in fast molds are already close to the goal of disposable molds. With the improvement of science and technology, the goal of disposable molds can be achieved and applied better. Traditional molds have an irreplaceable role in many occasions. In a sense, one of the main purposes of rapid mold manufacturing is to rapidly develop and make traditional molds. Moldless forming technology will be the first to be applied in some fields, and moldless forming is the goal of the future industry. For a long period of time in the future, these three models of mold manufacturing technology will coexist and play an important role.
USB4 specifies tunneling of:
USB 3.2 ("Enhanced Superspeed") Tunneling
DisplayPort 1.4a -based Tunneling
PCI Express (PCIe)-based Tunneling
Main Benefits of USB 4
The new USB 4 standard has three main benefits over prior versions of USB.
40 Gbps Maximum Speed: By using two-lane cables, devices are able to operate at up to 40 Gbps, the same speed as Thunderbolt 3. The data is transmitted in two sets of four bidirectional lanes.
DisplayPort Alt Mode 2.0: USB 4 supports DisplayPort 2.0 over its alternative mode. DisplayPort 2.0 can support 8K resolution at 60 Hz with HDR10 color. DisplayPort 2.0 can use up to 80 Gbps, which is double the amount available to USB data, because it sends all the data in one direction (to the monitor) and can thus use all eight data lanes at once.
Better Resource Allocation for Video, PCIe: In lieu of alternative mode where the other interface takes over the connection, USB 4 devices can use a process called "protocol tunneling" that sends DisplayPort, PCIe and USB packets at the same time while allocating bandwidth accordingly.
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