Silego Technologies has introduced a new family of GreenPAK ( GPAK ) programmable mixed-signal Matrix series in Santa Clara, California. It includes analog components, digital logic, programmable interconnects, flexible I/O, oscillators, and non-volatile storage, making them ideal for handheld and wearable products.
Silego 's NVM (Non-Volatile Storage) Programmable Mixed-Signal Matrix Device GPAK Series is designed to simply integrate some conventional discrete components as well as passive components into a single device. The SLG46110V combines the functionality and versatility of the GPAK family and is packaged in only 1.6x1.6x0.55mm, 8-GPIOSTQFN. This allows designers to achieve a new level of miniaturization, further reducing power loss, saving board space and reducing complex wiring. Undoubtedly, the SLG46110V is priced at a price of $0.12 for a million-dollar GPAK mature series that has been shipped from the market four years ago. It is a very competitive new product.
Like other devices in the GPAK family, the SLG46110V project can be developed with easy-to-use GPAK development hardware and a GPAK design software GUI interface to enable engineers to quickly and easily complete new designs or respond to design change needs.
"The SLG46110V has a huge advantage in the high-volume market based on board area, power loss and BOM cost," said Silego Marketing Director Nathan John. "The GreenPAK family offers a broad portfolio to support a wide range of mixed-signal functions. The new product allows designers to integrate discrete discrete components into the industry's smallest and lowest cost programmable mixed-signal Matrix array."
Target application:
Consumer electronics: portable, tablet, smart phone, notebook, PC and PC peripheral, wearable;
Commercial and industrial electronics: servers, embedded computers, data communication equipment.
PGA Sockets Pin Grid Array Socket
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
PGA Sockets & Adapters
Low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns.
PGA Sockets & Adapters Overview
Durable construction for virtually any application
Wide variety of materials, lengths, and sizes
Cost-effective method for replacing, repairing, or upgrading PGA devices
Unique options such as solder preform terminals eliminate the need for wave soldering in mixed SMT/Thru-hole applications
RoHS compliant insulators and screw-machined terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating
Antenk's Pin Grid Array (PGA) Sockets
Complex printed circuits are too valuable to risk direct soldering to expensive integrated circuits (ICs). Using a socket is the answer. The use of sockets offers advantages that prove cost effective and simplify board design.
Antenk's processor socket line is designed for use with Intel- and AMD-based microprocessor packages. Socket types include land grid array (LGA), micro pin grid array (mPGA), and PGA with low to zero insertion force. The mPGA and PGA sockets are designed for various microprocessor packages for notebook PCs, desktop PCs, and servers. For custom applications, the compression sockets can be configured to the specific application.
mPGA/PGA (ZIF)These sockets provide a zero insertion force (ZIF) PGA interface to the microprocessor PGA package and are attached to the PCB with surface-mount technology (SMT) soldering. PGA sockets are available in arrays up to 989 positions with single lever, screw driver, and hex wrench actuation methods.
PGA Sockets (LIF)
These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. Custom arrays are available in more than 1,000 positions.
Pin Grid Array (PGA) Sockets Type
mPGA
PGA
Eliminate hand-loading of pins, facilitate solder joint visibility, low profile component mounting or board mating.
PGA Sockets,mPGA Sockets,Integrated Circuits Socket,Pin Pga Sockets,Pga Socket Connector,PGA Adapters,Pin Grid Array Sockets,Processor Socket
ShenZhen Antenk Electronics Co,Ltd , https://www.antenk.com