This product was exhibited on the 19th printed circuit board EXPO held at the Tokyo International Exhibition Center from January 17th to January 19th, 2018.
Matsushita Electric Industrial Co., Ltd. Automotive Electronics and Electromechanical Systems has developed a "halogen-free ultra-low transmission loss substrate material (model: R-5515)" for the millimeter-wavelength [1] antenna substrate, and is scheduled to begin in April 2019. Mass production. The low transmission loss [2] of the industry's highest (*1) in the millimeter wave band by the thermosetting resin contributes to the high efficiency of the antenna, the low loss, and the reduction of the processing cost of the substrate.
In the context of the continuous development of ADAS (Advanced Driving Support System) and the development of autonomous driving, millimeter-wave radar has been used as a sensing technology to support these systems [3]. For an antenna substrate that performs millimeter wave transmission and reception, it is required to have low transmission loss. At present, as the substrate material for the antenna, a fluororesin substrate material [4] is mainly used. However, due to the properties of the resin, there is a problem that processing at the time of manufacturing the substrate is difficult and the cost is high. This time, our company's exclusive resin design technology and low-roughening copper foil bonding technology have achieved a "halogen-free ultra-low transmission loss substrate material" that combines excellent low transmission loss and processability.
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Low transmission loss, contributing to high efficiency and low loss of millimeter-band antennas
Transmission loss: 0.079dB/mm (@79GHz)
Our company's product (*2): 0.081dB/mm, general fluororesin substrate material (*3): 0.096dB/mm (the company's measured value (*4))
Excellent processability in manufacturing substrates, contributing to lower processing costs
Simultaneous molding with a common glass epoxy substrate material to contribute to the multilayering of the antenna-integrated module substrate
*1: As of January 11, 2018, as a thermosetting resin material used in the millimeter wave band, this material has the lowest transmission loss (investigation by the company)
*2: Our company's previous products (ultra low transmission loss multilayer substrate material "MEGTRON7" R-5785)
*3: General material for substrate material for antennas *4: Measurement by microstrip line configuration
[Use] Substrate for millimeter-wave antenna (carriage for vehicle-mounted millimeter-wave radar and antenna for wireless communication base station, etc.), high-speed transmission of substrates
1. The transmission loss is very low, contributing to the high efficiency and low loss of the millimeter-band antenna.
From the viewpoint of workability and cost of the substrate for an antenna, the market is required to replace the substrate material having high versatility of the fluorine substrate which is currently in the mainstream. Through exclusive resin design technology and low-roughening copper foil bonding technology, the company has developed a substrate material that achieves the lowest transmission loss in thermosetting resins. The low transmission loss of the same or higher than that of the fluororesin substrate contributes to the high efficiency and low loss of the millimeter-wavelength antenna.
2. Excellent processability when manufacturing substrates, contributing to lower processing costs of substrates
The fluororesin substrate is difficult to drill and copper-plated at the time of manufacturing a substrate due to the characteristics of the resin, and since a special manufacturing facility is required, there is a problem that the cost is too high. Since this material is a thermosetting resin material, it can be easily processed using existing equipment for general-purpose substrates. For this reason, the material can replace the fluororesin substrate material and contribute to reducing the processing cost of the substrate.
3. It can be molded simultaneously with a common glass epoxy substrate material to contribute to the multilayering of the antenna-integrated module substrate.
In the context of the miniaturization and low cost of the millimeter-wavelength module, the requirements for multi-layering of the antenna-integrated module substrate are increasing. Since the fluororesin substrate material is a thermoplastic resin, it is difficult to simultaneously form a glass epoxy substrate material of a thermosetting resin, and it is difficult to achieve multilayering for this purpose. Since this material is a thermosetting resin material, it is easier to form at the same time as the glass epoxy substrate material, contributing to the multilayering and cost reduction of the antenna-integrated module substrate.
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