As the end user's demand for a smooth user experience and access to the network at any time is soaring, high-processing performance, high mobility, and low power chip technologies are mentioned in more important positions.
Data applications stimulate chip innovation, Weibo, instant messaging, and other popular mobile Internet applications this year, stimulating global terminal manufacturers to focus their efforts on the smart terminal market. The fierce market competition has led to highly integrated chips due to their unique costs and The design advantage has been favored by more and more terminal companies. Under this trend, mainstream chip companies have successively released a series of smart terminal chip solutions this year, bringing intelligent terminal chips into the multi-core and high-computation capacity phase.
In the first half of this year, Qualcomm launched the revolutionary chip products in the industry, including the world's first HSPA chip, 3G/Lte multimode chip, and the world’s first 1GHz mobile single-core chip SnapdragON. It also introduced the world's first 1.4GHz mobile single-core chip, the world's first 1.5GHz mobile asynchronous dual-core chip, and a new single-core, dual-core, quad-core chipset based on the new microarchitecture, with the highest single-core speed in the Snapdragon product line. Up to 2.5GHz.
TI (Texas Instruments) has released a new generation of OMAP5 platform this year. OMAP5 is based on the ARM CortexA15 architecture and has a 2GHz clock speed performance.
In support of 3D technology, NVIDIA's Tegra2 chip is ahead of the industry chain. LG OptimusPad, which is capable of implementing naked-eye 3D this year, uses the Tegra2 dual-core processor. In addition to the Pad, Tegra2, known as the "super chip," has also been applied to many mainstream brands of mobile phones.
Broadcom Corporation is also actively expanding the field of smart phones and tablet computers, launched its dual-core processor platform BCM28150.
Responding to the huge demand for affordable smart phones, MediaTek Technologies in the smart terminal market this year to support Android's overall mobile phone solution MT6573, for the high-end market, MediaTek has also launched the EDGE mobile phone chip program MT6236, highlighting the powerful CPU features.
From the market competition of the chip, it can be seen that the dual-core war is constantly heating up, and the upgrading of core power has brought about accelerated development of terminal products. Next, the performance of smartphones is expected to exceed that of a real computer.
The TD chip capability is affirmed in the development of TD intelligent terminal chip technology. The chip is transitioning from single mode to multimode, and TD multi-core single-chip solutions are being widely adopted. And this year, the TD chip market is more competitive due to the addition of Marvell and other international brands, and the joint operation of Lianxin Technology and MediaTek.
According to the Secretary General of the TD Technology Forum, TD development had many advantages in the baseband and other aspects of the TD, but started late, plus the chip itself has a long development cycle. Prior to this, the integration, process, and power consumption were more than others. The 3G standard is a little less robust, but through the efforts of many chip manufacturers, the TD chip has reached the standard of mature 3G products in many indicators, which also directly promoted the TD-SCDMA smart terminal's leap-forward development this year.
Summarizing the problems of TD chips in the past, many companies including Lianxin Technology have launched new TD chips to reduce standby power consumption to less than 3.5mA. Lianxin Technology's LC1710 is said to enable “TDB’s fixed phone to achieve 200 yuan. The following, TD function machine to do less than 500 yuan, and based on a large number of commercial verification of the TD protocol stack to ensure the stable operation of the terminal." And core technology another single Modem program LC1711 is also based on the ARM9 and ZSP core, compared to the previous four The core has reduced two cores, making the cost and power consumption drop drastically.
In the second half of the year, China Mobile’s two highly-regarded TD smartphones, the ZTE Blade U880 and the Motorola MT620, were more cost-effective, resulting in more manufacturers’ willingness to cooperate with MARVELL’s PXA920 single-chip solution.
According to Marvell executives, a new generation of TD dual-carrier TD-HSPA+ chips has been developed, using the latest 40-nanometer technology, and has done some device compatibility tests with multiple vendors. The main frequency of the TD-SCDMA dual-core and single-core chips that will be sampled next year will be above 1GHz.
LTE proposes diverse application support requirements With the continuous emergence of single chips and the increasing demand for multi-mode and multi-frequency terminals, more and more chip companies have entered the LTE market, and the terminal industry chain will focus more on wireless broadband. Killer "experience" as a support for new programs and new technologies. Under the stimulation of LTE, the next-generation network's demand for chip integration capabilities and diverse application support capabilities is also increasing.
Strong chip manufacturers, including Qualcomm, are rushing to develop multi-mode multi-band chips that integrate 2G, 3G, and LTE (TDD/FDD) standards. In the LTE product line, the chip's highly integrated, multi-mode, cross-operating systems, and high processing and multimedia capabilities have received more attention.
After ST-Ericsson introduced the TD-LTE chipset last year and developed a multi-mode LTE/HSPA+ reference design, equipment and modules with SagemWireless, this year it also launched support for LTE dual-mode FDD, TDD, HSPA+, TD-SCDMA, EDGE's multi-mode chip platform. The recent introduction of its chip products to Nokia's new smart phone equipped with Microsoft's Windows Phone operating system has also broken the Windows Phone mobile phone has been using Qualcomm chips.
In the TD-LTE scale trial, the chip's mature capability has received the most attention. At present, there are more than a dozen chip companies to join, in addition to Hess Semiconductor and Chuangyi Video that have passed interoperability testing and entered a new phase of trials, Lianxin Technology. , Qualcomm, Spreadtrum, ST-Ericsson, Marvell, Sequace, MediaTek, etc. performed positively.
Zhang Daijun, president of STEricsson (China), said that currently the industry already has LTE-enabled smart phones, tablet computers, and devices that support data services (such as embedded modules), and that LTE technology will be used in M2M in the future. In other connected devices such as the field. LTE will replace fixed-line broadband connections and be used in connection with consumer electronics such as cameras and gaming devices, and mobile platforms will be the core of this.
Data applications stimulate chip innovation, Weibo, instant messaging, and other popular mobile Internet applications this year, stimulating global terminal manufacturers to focus their efforts on the smart terminal market. The fierce market competition has led to highly integrated chips due to their unique costs and The design advantage has been favored by more and more terminal companies. Under this trend, mainstream chip companies have successively released a series of smart terminal chip solutions this year, bringing intelligent terminal chips into the multi-core and high-computation capacity phase.
In the first half of this year, Qualcomm launched the revolutionary chip products in the industry, including the world's first HSPA chip, 3G/Lte multimode chip, and the world’s first 1GHz mobile single-core chip SnapdragON. It also introduced the world's first 1.4GHz mobile single-core chip, the world's first 1.5GHz mobile asynchronous dual-core chip, and a new single-core, dual-core, quad-core chipset based on the new microarchitecture, with the highest single-core speed in the Snapdragon product line. Up to 2.5GHz.
TI (Texas Instruments) has released a new generation of OMAP5 platform this year. OMAP5 is based on the ARM CortexA15 architecture and has a 2GHz clock speed performance.
In support of 3D technology, NVIDIA's Tegra2 chip is ahead of the industry chain. LG OptimusPad, which is capable of implementing naked-eye 3D this year, uses the Tegra2 dual-core processor. In addition to the Pad, Tegra2, known as the "super chip," has also been applied to many mainstream brands of mobile phones.
Broadcom Corporation is also actively expanding the field of smart phones and tablet computers, launched its dual-core processor platform BCM28150.
Responding to the huge demand for affordable smart phones, MediaTek Technologies in the smart terminal market this year to support Android's overall mobile phone solution MT6573, for the high-end market, MediaTek has also launched the EDGE mobile phone chip program MT6236, highlighting the powerful CPU features.
From the market competition of the chip, it can be seen that the dual-core war is constantly heating up, and the upgrading of core power has brought about accelerated development of terminal products. Next, the performance of smartphones is expected to exceed that of a real computer.
The TD chip capability is affirmed in the development of TD intelligent terminal chip technology. The chip is transitioning from single mode to multimode, and TD multi-core single-chip solutions are being widely adopted. And this year, the TD chip market is more competitive due to the addition of Marvell and other international brands, and the joint operation of Lianxin Technology and MediaTek.
According to the Secretary General of the TD Technology Forum, TD development had many advantages in the baseband and other aspects of the TD, but started late, plus the chip itself has a long development cycle. Prior to this, the integration, process, and power consumption were more than others. The 3G standard is a little less robust, but through the efforts of many chip manufacturers, the TD chip has reached the standard of mature 3G products in many indicators, which also directly promoted the TD-SCDMA smart terminal's leap-forward development this year.
Summarizing the problems of TD chips in the past, many companies including Lianxin Technology have launched new TD chips to reduce standby power consumption to less than 3.5mA. Lianxin Technology's LC1710 is said to enable “TDB’s fixed phone to achieve 200 yuan. The following, TD function machine to do less than 500 yuan, and based on a large number of commercial verification of the TD protocol stack to ensure the stable operation of the terminal." And core technology another single Modem program LC1711 is also based on the ARM9 and ZSP core, compared to the previous four The core has reduced two cores, making the cost and power consumption drop drastically.
In the second half of the year, China Mobile’s two highly-regarded TD smartphones, the ZTE Blade U880 and the Motorola MT620, were more cost-effective, resulting in more manufacturers’ willingness to cooperate with MARVELL’s PXA920 single-chip solution.
According to Marvell executives, a new generation of TD dual-carrier TD-HSPA+ chips has been developed, using the latest 40-nanometer technology, and has done some device compatibility tests with multiple vendors. The main frequency of the TD-SCDMA dual-core and single-core chips that will be sampled next year will be above 1GHz.
LTE proposes diverse application support requirements With the continuous emergence of single chips and the increasing demand for multi-mode and multi-frequency terminals, more and more chip companies have entered the LTE market, and the terminal industry chain will focus more on wireless broadband. Killer "experience" as a support for new programs and new technologies. Under the stimulation of LTE, the next-generation network's demand for chip integration capabilities and diverse application support capabilities is also increasing.
Strong chip manufacturers, including Qualcomm, are rushing to develop multi-mode multi-band chips that integrate 2G, 3G, and LTE (TDD/FDD) standards. In the LTE product line, the chip's highly integrated, multi-mode, cross-operating systems, and high processing and multimedia capabilities have received more attention.
After ST-Ericsson introduced the TD-LTE chipset last year and developed a multi-mode LTE/HSPA+ reference design, equipment and modules with SagemWireless, this year it also launched support for LTE dual-mode FDD, TDD, HSPA+, TD-SCDMA, EDGE's multi-mode chip platform. The recent introduction of its chip products to Nokia's new smart phone equipped with Microsoft's Windows Phone operating system has also broken the Windows Phone mobile phone has been using Qualcomm chips.
In the TD-LTE scale trial, the chip's mature capability has received the most attention. At present, there are more than a dozen chip companies to join, in addition to Hess Semiconductor and Chuangyi Video that have passed interoperability testing and entered a new phase of trials, Lianxin Technology. , Qualcomm, Spreadtrum, ST-Ericsson, Marvell, Sequace, MediaTek, etc. performed positively.
Zhang Daijun, president of STEricsson (China), said that currently the industry already has LTE-enabled smart phones, tablet computers, and devices that support data services (such as embedded modules), and that LTE technology will be used in M2M in the future. In other connected devices such as the field. LTE will replace fixed-line broadband connections and be used in connection with consumer electronics such as cameras and gaming devices, and mobile platforms will be the core of this.
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