TSMC Chairman Zhang Zhongmou revealed that it will increase capital expenditure this year. The new amount will be greater than last year's 7.29 billion US dollars (about NT$215.2 billion), and it is likely to surpass Samsung's logic chip system division (LSI)'s $7.3 billion; this is not only TSMC. The new high record highlights the attempt to resist Samsung.
TSMC’s original capital expenditure this year was $6 billion, a decrease of 17.7% compared with last year. However, with the 28-nanometer production capacity tightening, it has been determined that the capital expenditure will be raised. The chairman of TSMC revealed in the Science and Technology Forum that the amount will be higher than last year's 7.29 billion US dollars, and the actual amount will be announced on the 26th. TSMC also stressed that this year's increase in capital expenditure is due to the insufficient production capacity of 28 nm, which is not the consideration of 28 nm yield. The current 28 nm yield is under control.
It is worth noting that Samsung LSI, one of TSMC's competitors, is optimistic about the application processor demand brought by mobile devices. This year's capital expenditure has increased to 7.3 billion US dollars, with an annual growth rate of 75%. Its Austin plant in Texas, USA. The production capacity of 30,000 to 40,000 pieces is almost prepared for the Apple processor, and it is also the main demand for Samsung to significantly increase capital expenditure.
It is understood that Qualcomm, Huida, and Chaowei are all 28-meter customers of TSMC. In order to solve customer demand, TSMC has been put into production in the first and second phases of Zhongke Fa15. In the first quarter, TSMC's 12-month capacity was about 304,000. Under the company's full expansion, equipment manufacturers estimate that TSMC's three large fabs are expected to contribute 400,000 wafers to the 12-month wafer-to-battery capacity by the end of this year, three to four times ahead of rival Samsung.
TSMC’s original capital expenditure this year was $6 billion, a decrease of 17.7% compared with last year. However, with the 28-nanometer production capacity tightening, it has been determined that the capital expenditure will be raised. The chairman of TSMC revealed in the Science and Technology Forum that the amount will be higher than last year's 7.29 billion US dollars, and the actual amount will be announced on the 26th. TSMC also stressed that this year's increase in capital expenditure is due to the insufficient production capacity of 28 nm, which is not the consideration of 28 nm yield. The current 28 nm yield is under control.
It is worth noting that Samsung LSI, one of TSMC's competitors, is optimistic about the application processor demand brought by mobile devices. This year's capital expenditure has increased to 7.3 billion US dollars, with an annual growth rate of 75%. Its Austin plant in Texas, USA. The production capacity of 30,000 to 40,000 pieces is almost prepared for the Apple processor, and it is also the main demand for Samsung to significantly increase capital expenditure.
It is understood that Qualcomm, Huida, and Chaowei are all 28-meter customers of TSMC. In order to solve customer demand, TSMC has been put into production in the first and second phases of Zhongke Fa15. In the first quarter, TSMC's 12-month capacity was about 304,000. Under the company's full expansion, equipment manufacturers estimate that TSMC's three large fabs are expected to contribute 400,000 wafers to the 12-month wafer-to-battery capacity by the end of this year, three to four times ahead of rival Samsung.
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